The silicon wafer heating solution, based on the market-leading IPG DLS-ECO laser heating platform, dramatically reduces the energy consumption and maintenance costs of heating silicon wafers while also improving productivity. The 970 nm laser light is efficiently and directly absorbed by the silicon wafer, ensuring minimal energy is lost to the surrounding heating chamber. Simulations and experimental data demonstrate that less than 20 kW of optical energy is required to heat a 300 mm silicon wafer to 800° C in under 10 seconds while even less power (<15 kW) is needed to maintain the temperature.
DLS-ECO 激光加热源的电光转换效率为 55%，更大程度地降低了能耗。光能通过光纤传输，使激光源能够在洁净室以外的环境中运行，而洁净室内很容易提供冷却水等公用设施。硅晶圆加热解决方案预计可在至少七年的不间断运行中提供免维护操作。
要进一步了解二极管激光器如何成为晶片加热的理想解决方案，请单击此处阅读《硅半导体》杂志的完整文章。
关于 IPG Photonics
IPG Photonics 公司是高功率光纤激光器和放大器领域的领先企业，产品主要用于材料加工和其他各种应用。公司的使命是使其光纤激光器技术成为大规模生产的理想工具。与其他类型的激光器和非激光工具相比，IPG 以较低的总拥有成本提供卓越的性能、可靠性和可用性，使终端用户能够提高生产率并降低成本，从而完成这一使命。IPG 总部位于马萨诸塞州马尔伯勒，在全球拥有 30 多家工厂。
用激光将 200 毫米硅晶片加热到 800°C 的可见光图像。